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RELIFE RL-404 Solder Flux Lead-free Low Temperature 138 Tin Paste
RelifeSKU: IPG-RT-00693
RELIFE RL-404 Solder Flux Lead-free Low Temperature 138 Tin Paste. Heat resistance: up to 138 °C; Application: Mobile phone, tablet and computer repair; Device: Model numbers.
- Brand
- Relife
- Minimum quantity
- Confirm with your quote
Compatibility comes firstDouble-check your exact phone model before sending your request.
About this item
RELIFE RL-404 Solder Flux Lead-free Low Temperature 138 Tin Paste.
Product details
- Heat resistance
- up to 138 °C
- Application
- Mobile phone, tablet and computer repair
- Device
- Model numbers
- For mobile phone, tablet and computer repair
- —
Specifications
- Heat resistance
- up to 138 °C
- Application
- Mobile phone, tablet and computer repair
- Device
- Model numbers
- For mobile phone, tablet and computer repair
- —
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