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Narzędzia naprawcze
Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
Kod produktu: IPG-RT-00104-01
Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM. Option: What you receive; BGA153 Stencil: BGA153 Stencil version; BGA169 Stencil: BGA169 Stencil version.
- Model telefonu
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Minimalna ilość
- Do potwierdzenia przy wycenie
Najpierw zgodnośćSprawdź dokładny model telefonu przed wysłaniem zapytania.
O tym produkcie
Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM.
Product details
- Option
- What you receive
- BGA153 Stencil
- BGA153 Stencil version
- BGA169 Stencil
- BGA169 Stencil version
- BGA162 Stencil
- BGA162 Stencil version
- BGA186 Stencil
- BGA186 Stencil version
- BGA221 Stencil
- BGA221 Stencil version
- BGA254 Stencil
- BGA254 Stencil version
- Magnet Base
- Magnet Base version
- Positioning Plate
- Positioning Plate version
- Works with
- Model numbers
- Compatibility
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Available version
- BGA153 Stencil; BGA169 Stencil; BGA162 Stencil; BGA186 Stencil; BGA221 Stencil; BGA254 Stencil; Magnet Base; Positioning Plate
Specyfikacja
- Option
- What you receive
- BGA153 Stencil
- BGA153 Stencil version
- BGA169 Stencil
- BGA169 Stencil version
- BGA162 Stencil
- BGA162 Stencil version
- BGA186 Stencil
- BGA186 Stencil version
- BGA221 Stencil
- BGA221 Stencil version
- BGA254 Stencil
- BGA254 Stencil version
- Magnet Base
- Magnet Base version
- Positioning Plate
- Positioning Plate version
- Works with
- Model numbers
- Compatibility
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Available version
- BGA153 Stencil; BGA169 Stencil; BGA162 Stencil; BGA186 Stencil; BGA221 Stencil; BGA254 Stencil; Magnet Base; Positioning Plate
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