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Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
Artikelnummer: IPG-RT-00104-01
Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM. Option: What you receive; BGA153 Stencil: BGA153 Stencil version; BGA169 Stencil: BGA169 Stencil version.
- Telefoonmodel
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Minimumaantal
- Bevestigen bij de offerte
Compatibiliteit komt eerstControleer je exacte telefoonmodel voordat je de aanvraag verstuurt.
Over dit product
Amaoe BGA153 BGA169 BGA162 BGA254 BGA221 BGA186 Reballing Stencil for EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM.
Product details
- Option
- What you receive
- BGA153 Stencil
- BGA153 Stencil version
- BGA169 Stencil
- BGA169 Stencil version
- BGA162 Stencil
- BGA162 Stencil version
- BGA186 Stencil
- BGA186 Stencil version
- BGA221 Stencil
- BGA221 Stencil version
- BGA254 Stencil
- BGA254 Stencil version
- Magnet Base
- Magnet Base version
- Positioning Plate
- Positioning Plate version
- Works with
- Model numbers
- Compatibility
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Available version
- BGA153 Stencil; BGA169 Stencil; BGA162 Stencil; BGA186 Stencil; BGA221 Stencil; BGA254 Stencil; Magnet Base; Positioning Plate
Specificaties
- Option
- What you receive
- BGA153 Stencil
- BGA153 Stencil version
- BGA169 Stencil
- BGA169 Stencil version
- BGA162 Stencil
- BGA162 Stencil version
- BGA186 Stencil
- BGA186 Stencil version
- BGA221 Stencil
- BGA221 Stencil version
- BGA254 Stencil
- BGA254 Stencil version
- Magnet Base
- Magnet Base version
- Positioning Plate
- Positioning Plate version
- Works with
- Model numbers
- Compatibility
- EMMC CPU IC Chip Tin Planting Soldering Net 0.15MM
- Available version
- BGA153 Stencil; BGA169 Stencil; BGA162 Stencil; BGA186 Stencil; BGA221 Stencil; BGA254 Stencil; Magnet Base; Positioning Plate
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